vj5601m915mxbsr www.vishay.com vishay vitramon revision: 28-mar-12 1 document number: 45208 for technical questions, contact: chipantenna@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 surface mount ceramic chip antennas for 915 mhz vj5601m915mxbsr chip antenna product vishay vj5601m915mxbsr chip antennas are covered by one or more of th e following patents: wo2008250262 (a1), us2008303720 (a1), us2008305750 (a1), wo2008154173 (a1) other patents are pending. description the vj5601m915mxbsr ceramic chip antenna is a small form-factor, high-performance, chip-antenna designed for operation at 915 mhz. it allows manufacturers to design high quality products that do not bear the penalty of a large external antenna, and is designed to be assembled onto a pc board using a standard reflow process. the vj5601m915 is the latest in a family of products developed by vishay, a world leader in manufacturing of discrete and passive components. the vj5601m915 series are small form-factor, high-performance chip-ante nnas optimized for medical, remote sensing, indu strial, security, and rfid applications. utilizing unique vishay materials and manufacturing technologies, these product s when properly tuned also comply with the mbrai standard for portable communication. features ? small outline (15.5 mm x 10.5 mm x 1.2 mm) ?50 ? unbalanced tuning interface (max. 1.73 dbi gain (1) ) ? assembled onto a pcb in the standard reflow process ? 160 mhz half-power tuned bandwidth (835 to 995 mhz) ? high-reliability ceramic-oxide body construction ? low-rf loss, high-q ceramic ? lead (pb)-free/wet build process ? reliable noble metal electrode (nme) system ? wide operating temperature range (- 40 c to + 85 c) ? material categorization: for definitions of compliance please see www.vishay.com/doc?99912 note (1) see figures 1 through 6 for more details on the radiation pattern (antenna gain) at 915 mhz; the pcb board ground is shorted to earth ground for tuning. applications ? medical telemetry (internal/external) ? remote sensing and control ? industrial automation and telemetry ? security systems, home automation ? long range rfid electrical specifications operating temperature: - 40 c to + 85 c frequency range (transmission/reception): 835 mhz to 995 mhz note ? electrical characteristics at + 25 c unless otherwise specified. antenna performance is meas ured at 915 mhz and 50 ? impedance unless otherwise specified. the best results are obtained by mounting the chip following the layout guidelines application note for the evaluation kit. quick reference data series frequency (mhz) max. gain (dbi) average gain (dbi) bandwidth (- 10 db) (mhz) bandwidth (- 3 db) (mhz) vj5601m915mxbsr 915 1.73 - 2.73 41 160 chip antenna performance nominal frequency (mhz) nominal impedance ( ? ) 915 mh z average gain (dbi) 915 mh z peak gain (dbi) reflected power coefficient s11 915 mh z reflected power loss - 3 db bandwidth 835 mhz to 995 mhz (mhz) - 3 db reflected power loss - 10 db bandwidth 894 mhz to 937 mhz (mhz) - 10 db reflected power loss 915 50 - 2.73 1.73 < - 32 db 0.6 % 160 50 % 41 10 % 0.6 % < 0.003 db 3 db 0.46 db
vj5601m915mxbsr www.vishay.com vishay vitramon revision: 28-mar-12 2 document number: 45208 for technical questions, contact: chipantenna@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 vj5601m915mxbsr tuning final tuning configuration and component values for l1, l2, and c1 depend on customer pcb layout. optimal tuning is possible with just a few stan dard components. the nominal values shown are for a tuned VJ5601M915MXBEK kit. fig. 1 - tuning example with inductors l1, l2 and capacitor c1 fig. 2 - vj5601m915 tuned to 915 mhz with > 99.9 % power coupled fig. 3 - vj5601m915 pcb mountin g and coordinate directions fig. 4 - vj5601m915mxbsr xy radiation pattern fig. 5 - vj5601m4915mxbsr yz radiation pattern fig. 6 - vj5601m915mxbsr xz radiation pattern -35 -30 -25 -20 -15 -10 -5 0 835 875 915 955 995 power reflection s 11 db (50 ) frequency (mhz) v501m15 db power reflection s11 (db) versus frequency (mhz) power ouin t 15 mhz or v501m15 mhz rotation plane = 0 receiver direction xy y-axis yz z-axis xz z-axis the radiaon paerns reference the elevaon that is perpendicular to the azimuth pole rotaon in . -38 -28 -18 -8 2 90 75 60 45 30 15 0 -15 -30 -45 -60 -75 -90 -105 -120 -135 -150 -165 180 165 150 135 120 105 xy / ? dbi rotaon plane / horizontal e-?eld polarizaon pole rotaon ? -41 -31 -21 -11 -1 90 75 60 45 30 15 0 -15 -30 -45 -60 -75 -90 -105 -120 -135 -150 -165 180 165 150 135 120 105 yz / ? dbi rotaon plane / horizontal e-?eld polarizaon pole rotaon ? -38 -28 -18 -8 2 90 75 60 45 30 15 0 -15 -30 -45 -60 -75 -90 -105 -120 -135 -150 -165 180 165 150 135 120 105 xz / dbi rotaon plane / vercal e-?eld polarizaon pole rotaon ?
vj5601m915mxbsr www.vishay.com vishay vitramon revision: 28-mar-12 3 document number: 45208 for technical questions, contact: chipantenna@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 footprint, mechanical and pcb dimensions the antenna footprint and mechanical dimensions are presented in figure 7. optima l tuning is adjusted according to pcb layout. for additional mechanical su pport, it is recommended to add one drop of heat curing epoxy glue. ? the glue dot should not over lap with any of the soldering pads ? apply the glue dot at the center of the antenna. ? the glue dot area secures the chip firmly to the pcb fig. 7 - footprint, chip antenna mechanical dimensions, and pcb layout dimensions of vj5601m915 fig. 8 - soldering ir reflow with snpb solder fig. 9 - soldering reflow with sn solder time 30 s to 60 s 30 s to 60 s 30 s to 60 s 0 50 100 150 200 250 300 t (c) > 215 c: 20 s to 40 s max. temperature min. temperature sn-pb eutectic solder paste t (s) 0 50 100 150 200 250 300 t (c) 260 c 50 100 150 200 250 245 c 215 c 180 c 130 c 40 s 10 s 10 s 2 k/s ? ?
vj5601m915mxbsr www.vishay.com vishay vitramon revision: 28-mar-12 4 document number: 45208 for technical questions, contact: chipantenna@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 vj5601m915 assembly guidelines 1. mounting of antennas on a printed circui t board should be done by reflow solder ing using the profiles shown (figures 8, 9, and 10) 2. in order to provide the ad equate strength between the antenna and the pcb apply of a dot of heat cured epoxy glue in the center of the footprint of the antenna prior to soldering the antenna to the board. an example for such glue is heraeus pd 860002 sa. the weight of the dot should be 5 mg to 10 mg. fig. 10 - soldering ir reflow with snagcu solder note (1) the vj5601m915 kit is available for eval uation. for sample s, please contact mlcc-samples@vishay.com . 0 50 100 150 200 250 300 t (c) time 60 s to 120 s 30 s to 60 s max. temperature min. temperature sn-ag-cu solder paste 60 s to 120 s 60 s to 120 s ordering information vishay material packaging quantity vj5601m915 chip antenna vj5601m915mxbsr 1000 pieces vj5601m915 evaluation kit (1) VJ5601M915MXBEK 1 kit
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